• 君临国际

    PT-9200
    8 Inch Automatic Probe Station
    High-precision positioning platform (positioning accuracy of ±2 microns)
    Meet test of 2,000 probes, used for multi-core simultaneous detection, improving production capacity and benefits
    High-precision optical module, combined with the latest image software algorithm, achieving automatic and accurate positioning of probes, and safe and reliable full-automatic test
    Through the unique mechanical arm adsorption technology, achieve nondestructive automatic loading and unloading transmission of Taiko\ltrathin\warpage wafers, etc.
    CHUCK's modular design, making selection and replacement more convenient and fast
    Equipped with a large-size probe grinding table to adapt to different probe grinding manners
    Test application

    Suitable for wafer testing of integrated circuits and power devices of 8 inches and below

    Test application
    High-pressure test
    Large current test
    High-temperature test
    Radio frequency test
    WAT test
    Re-measurement of an NG point
    Test under high or low temperature
    Main functions
    Automatic probe alignment
    Automatic wafer alignment
    Automatic detection of wafer thickness
    CHUCK automatic cleaning
    Automatic reading of wafer IDs
    Automatic dotting
    Probe mark detection
    Automatic probe cleaning
    Real-time MAP display and product storage
    Special application
    Notch-free prealignment
    Shading treatment
    Consultation/Complaint
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    Content
    0755-28938875