1. High-Stability Motion Platform: Features a nanometer-grade motion platform coupled with an active vibration isolation system, achieving a vibration criterion rating of VC-D.
2. Ultra-High Resolution Optics: Equipped with a precision microscopic optical system offering superior resolution. Optical inspection accuracy is < 0.2 µm.
3. Hybrid Optical & AFM Metrology: Implements a combined optical inspection and Atomic Force . Microscopy (AFM) solution, enabling fast, visualized metrology for any region of interest.
4. Advanced Image Processing: Utilizes high-precision cross-field image alignment, intelligent image stitching, and fusion technology with an alignment error of < 0.2 pixels.
5. Maskless Inspection & Layout Synthesis: Supports maskless scanning inspection, capable of reverse synthesizing ultra-large layouts with results displayed with real-time updates.
6. High-Throughput Computing: Capable of acquiring and inspecting > 100,000 images per wafer. Powered by GPU parallel acceleration for rapid computation and ultra-high-speed database storage.